• 3D Heterogeneous Integration

    Micross Components (Durham, NC)
    …This position will support the Micross 3D Heterogeneous Integration program areas, including: + Development of semiconductor advanced packaging processes ... and technologies + 2.5/ 3D integration : TSV processing, wafer thinning &...engineering staff are to support Program Managers and technology development projects in the form of day-to-day project management… more
    Micross Components (12/10/24)
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  • 3D Heterogenous Integration Engineer…

    Global Foundries (Malta, NY)
    …team members life-long connections and skills.​ Summary of Role: 3D Advanced Heterogeneous Integration Development Engineer which includes wafer to wafer ... full-service semiconductor foundry providing a unique combination of design, development , and fabrication services to some of the world's...develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes. +… more
    Global Foundries (02/04/25)
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  • 3D /Heterogenous Integration

    NY CREATES (Albany, NY)
    …Category: Engineering Posted On: Fri Jan 10 2025 Job Description: Job Description for 3D / Heterogeneous Integration Engineer JOB SUMMARY NY CREATES is looking ... for an experienced 3D / Heterogeneous Integration Engineer to support...Job responsibilities include, but are not limited to: + Development of 3D /HI processes and technologies from… more
    NY CREATES (01/10/25)
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  • Assistant/Associate Professor - Semiconductors…

    The University of Texas at Arlington (Arlington, TX)
    …areas. Areas of special interest include, but are not limited to: (1) ** 3D Heterogeneous integration (3DHI):** electronic and photonic interconnect ... integration , chip-scale micro- and nano-systems, heterogeneous integration platforms including 2.5D and 3D . (2) **Photonic integrated circuits… more
    The University of Texas at Arlington (01/17/25)
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  • ASIC Packaging Engineer

    Meta (Menlo Park, CA)
    …package stress analysis and what-if scenarios for novel packaging schemes such as 2.5D/ 3D and heterogeneous integration to improve package manufacturability ... the development of custom silicon and looking for expertise in hardware development and integration of machine learning clusters, both server and fabric with… more
    Meta (11/14/24)
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  • Silicon Packaging Design Engineer

    Meta (Sunnyvale, CA)
    …Perform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/ 3D and heterogeneous integration to improve bandwidth, power ... the development of custom silicon and looking for expertise in hardware development and integration of machine learning clusters, both server and fabric with… more
    Meta (01/17/25)
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  • Product Line Manager

    Micross Components (Research Triangle Park, NC)
    …experienced Business Development person to help grow its Wafer Level Packaging and 3D Heterogeneous Integration (3DHI) product lines with a focus on ... This position will serve primarily as an outward facing Business Development person identifying and developing opportunities with existing and potential clients… more
    Micross Components (12/10/24)
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  • Sr Manager, Electrical Engineering

    Mercury Systems (Phoenix, AZ)
    …Ability to obtain a DoD Secret Clearance Preferred Qualifications: * Package design of 3D devices, heterogeneous integration , System in Package (SiP) design ... mentor engineers responsible for electrical design engineering of our advanced 2D/2.5D/ 3D packaging solutions. You will proactively identify problems and generate… more
    Mercury Systems (01/16/25)
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