- Global Foundries (Malta, NY)
- Summary of Role: 3D Advanced Heterogeneous Integration Development Engineer which includes wafer to wafer hybrid bonding, die to wafer hybrid bonding, ... Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes. + Develop expertise in the processes, materials and tooling… more
- Micron Technology, Inc. (Richardson, TX)
- …how the world uses information to enrich life. As an HBM SOC Design and Integration Engineer , you will be responsible for the design & development of ... Micron's HBM product portfolio. In HBM HIG (High Bandwidth Memory - Heterogenous Integration Group), we innovate and integrate end-to-end groundbreaking… more
- SpaceX (Bastrop, TX)
- …experience with microelectronics packaging development + Familiarity with 2D, 2.5D, and/or 3D packaging integration + Packaging familiarity with flip-chip, BGA, ... Principal IC Packaging Engineer , Silicon Technology (Starlink) at SpaceX Bastrop, TX...system-in-package SiP, multi-chip modules MCM, wirebond, panel level packaging, heterogenous and chiplet integration + Hands-on packaging,… more
- Micron Technology, Inc. (Richardson, TX)
- …Micron's HBM product portfolio. In HBM HIG (High Bandwidth Memory - Heterogenous Integration Group), we innovate and integrate end-to-end groundbreaking ... to enrich life. As an HBM SOC Pre-Silicon Verification Engineer , you will be responsible for the design &...high-speed interface design, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze… more
- Micron Technology, Inc. (Richardson, TX)
- …Micron's HBM product portfolio. In HBM HIG (High Bandwidth Memory - Heterogenous Integration Group), we innovate and integrate end-to-end groundbreaking ... to enrich life. As an HBM SOC Physical Design Engineer , you will be responsible for the design &...high-speed interface design, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze… more