• Advanced Package Technology

    Broadcom (San Jose, CA)
    technology with BRCM's needs pushing the technology limits. *Job Scope ( Advanced Package Technology Engineer ) -Provide deeper expertise in 2.5D ... & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural… more
    Broadcom (03/13/25)
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  • Principal Software Engineer

    RTX Corporation (Cedar Rapids, IA)
    …Cedar Rapids, IA, 52498-0505 USA **Position Role Type:** Onsite **Principal Software Engineer ** **- Advanced Technology (Onsite)** **Description:** Looking ... team is looking for a motivated, disciplined, experienced SW system architect principal engineer . In this role, the candidate will be responsible for managing the… more
    RTX Corporation (03/04/25)
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  • Principal RF Microwave Design Engineer

    Northrop Grumman (Linthicum, MD)
    …FEKO, SENTRi, or other computational electromagnetics software tools **Preferred Qualifications:** + Advanced degrees in Science, Technology , Engineer , or ... areas across the lifecycle of a program. + Apply advanced technical principles, theories, and concepts while contributing to...or Ph.D with 1 year of experience in Science, Technology , Engineer , or Mathematics or other related… more
    Northrop Grumman (03/09/25)
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  • Principal Digital Engineer /Senior…

    Northrop Grumman (Linthicum, MD)
    …Quartus. + Ability to be cleared to special access programs. Preferred Qualifications: + Advanced degrees in Science, Technology , Engineer , or Mathematics or ... + Work with interdisciplinary teams on research, design, and development for advanced digital designs and subsystems + Support the design and implementation of… more
    Northrop Grumman (02/07/25)
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  • Lead Advanced Microelectronics…

    The Boeing Company (El Segundo, CA)
    …with us. Boeing Defense Space & Security has an exciting opportunity as a **Lead Advanced Microelectronics Packaging Design Engineer ** . Come join us as part ... design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools. **Preferred… more
    The Boeing Company (03/04/25)
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  • Principal IC Packaging Engineer

    SpaceX (Bastrop, TX)
    Principal IC Packaging Engineer , Silicon Technology (Starlink) at SpaceX Bastrop, TX SpaceX was founded under the belief that a future where humanity is out ... goal of enabling human life on Mars. PRINCIPAL IC PACKAGING ENGINEER , SILICON TECHNOLOGY (STARLINK)...design, materials, thermal, systems, and production teams + Implement advanced packaging solutions into SpaceX next generation… more
    SpaceX (01/26/25)
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  • Engineer - Advanced Packaging

    Micron Technology, Inc. (Boise, ID)
    …inspiring the world to learn, communicate and advance faster than ever. As an Advanced Packaging Engineer you will be primarily responsible for starting ... how the world uses information to enrich life for** **_all_** **.** Micron Technology is a world leader in innovating memory and storage solutions that accelerate… more
    Micron Technology, Inc. (01/17/25)
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  • Sr. IC Packaging Engineer , Silicon…

    SpaceX (Bastrop, TX)
    Sr. IC Packaging Engineer , Silicon Technology (Starlink) at SpaceX Bastrop, TX SpaceX was founded under the belief that a future where humanity is out ... goal of enabling human life on Mars. SR. IC PACKAGING ENGINEER , SILICON TECHNOLOGY (STARLINK)...design, materials, thermal, systems, and production teams + Implement advanced packaging solutions into SpaceX next generation… more
    SpaceX (01/23/25)
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  • Advanced Packaging Process…

    Micron Technology, Inc. (Boise, ID)
    …level bonding, or MS degree + 5(+) years of industry experience specific to Advanced Packaging and wafer-to-wafer bonding. As a world leader in the semiconductor ... uses information to enrich life for** **_all_** **.** Micron Technology is a world leader in innovating memory and...ever. Responsibilities will include: * Develop, diagnose and resolve packaging process related problems for Die and Wafer bonding… more
    Micron Technology, Inc. (12/26/24)
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  • Advanced Packaging Research…

    IBM (Albany, NY)
    …molding, laminate, reliability, and failure analysis to support the chiplet and advanced packaging initiatives for IBM Semiconductors in Albany, New York. ... **Preferred technical and professional experience** 1) Hands on experience in semiconductor 3D packaging technology , 2) More than 5 years experience of flip chip… more
    IBM (02/07/25)
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