• IC Packaging Engineer

    SpaceX (Bastrop, TX)
    IC Packaging Engineer , Silicon Technology (Starlink) Bastrop, TX Apply SpaceX was founded under the belief that a future where humanity is out exploring ... make this possible, with the ultimate goal of enabling human life on Mars. IC PACKAGING ENGINEER , SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its… more
    SpaceX (04/15/25)
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  • Principal IC Packaging

    SpaceX (Bastrop, TX)
    Principal IC Packaging Engineer , Silicon Technology (Starlink) Bastrop, TX Apply SpaceX was founded under the belief that a future where humanity is out ... possible, with the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING ENGINEER , SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its… more
    SpaceX (04/15/25)
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  • Sr. IC Packaging Test…

    SpaceX (Bastrop, TX)
    Sr. IC Packaging Test Engineer , Silicon Technology (Starlink) Bastrop, TX Apply SpaceX was founded under the belief that a future where humanity is out ... ultimate goal of enabling human life on Mars. SR. IC PACKAGING TEST ENGINEER , SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its experience in… more
    SpaceX (04/15/25)
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  • IC Packaging Test Engineer

    SpaceX (Bastrop, TX)
    IC Packaging Test Engineer , Silicon Technology (Starlink) Bastrop, TX Apply SpaceX was founded under the belief that a future where humanity is out ... the ultimate goal of enabling human life on Mars. IC PACKAGING TEST ENGINEER , SILICON TECHNOLOGY (STARLINK) Starlink believes in providing fast, reliable… more
    SpaceX (04/15/25)
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  • IC Layout Engineer ( Silicon

    SpaceX (Irvine, CA)
    IC Layout Engineer ( Silicon ...power and ground distribution as well as working with packaging engineer to determine pad locations + ... this possible, with the ultimate goal of enabling human life on Mars. IC LAYOUT ENGINEER ( SILICON ENGINEERING) At SpaceX we're leveraging our experience in… more
    SpaceX (04/15/25)
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  • Silicon Reliability Engineer

    Google (Fremont, CA)
    …burn-in hardware for backplane (CMOS) ICs. + Work with external vendors to design custom IC packaging and hardware for ESD and latch-up testing. + Lead failure ... practical experience. + 4 years of experience in semiconductor IC reliability, or 3 years of experience with an...commonly used tools like JMP, Reliasoft, etc. As a Silicon Reliability Engineer , you will be responsible… more
    Google (03/19/25)
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  • Integrated Circuit ( IC ) Layout and Mask…

    MIT Lincoln Laboratory (Lexington, MA)
    …lithographic mask layout, material growth and characterization, fabrication (eg, silicon , compound-semiconductor, wafer bonding, flip-chip hybrid), packaging , ... growth, charge-coupled device (CCD) imagers, 193-nm lithography, fully depleted silicon -on-insulator (FDSOI) CMOS electronics, semiconductor diode lasers and amplifiers,… more
    MIT Lincoln Laboratory (03/12/25)
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  • Lead Advanced Microelectronics Packaging

    The Boeing Company (El Segundo, CA)
    …in multi-functional discussions for package architecture and technology roadmap (partner with Silicon IC team to optimize chip Floorplan and bump placement). ... has an exciting opportunity as a **Lead Advanced Microelectronics Packaging Design Engineer ** . Come join us...Designing and optimizing layout for advanced substrates of HDI IC substrate, Silicon , or LTCC substrates, considering… more
    The Boeing Company (03/30/25)
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  • SiliconOne Mechanical Packaging

    Cisco (San Jose, CA)
    …or if a sufficient number of applications are received. Who We Are Cisco Silicon One is a business organization building and selling ASICs inside and outside of ... Cisco. We have a long track record of building large, high-performance Silicon ASICs for Cisco's internal platforms and external customers. We are a specialized ASIC… more
    Cisco (02/12/25)
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  • Master Engineer

    Broadcom (Irvine, CA)
    …including bump cell definition (metal scheme, geometry, metallurgy etc.) Manage IC packaging activity from concept through development, qualification through ... (eg 224G PAM4, 112GPAM4, HBM2e/3) for new advanced node silicon (7nm, 5nm, 3nm..) chip floor plan & IP...integrity [PI] requirements) Work with business unit marketing and IC design teams to select the optimum package solution… more
    Broadcom (03/29/25)
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