- The Boeing Company (El Segundo, CA)
- …future with us. Boeing Defense Space & Security has an exciting opportunity as a ** Lead Advanced Microelectronics Packaging Design Engineer** . Come join ... us as part of our Electronics Packaging team located in **El Segundo, CA** . ...#YouWillChangeTheWorld **Position Responsibilities:** + Designing and optimizing layout for advanced substrates of HDI IC substrate, Silicon, or LTCC… more
- The Boeing Company (El Segundo, CA)
- …+ 10+ years of experience supporting proposals (technical, cost, and schedule) with advanced microelectronics packaging content + Experience with maturing ... plans **Preferred Qualifications (Desired Skills/Experience):** + Experience with transitioning advanced microelectronics from R&D to production + 10+… more
- Mercury Systems (Phoenix, AZ)
- … area, your efforts will be connected to the Data Management and Microelectronics businesses. You will specifically lead and mentor engineers responsible for ... and procedures and collaborating to deliver leading edge secure microelectronics that are game-changing and impactful to our nation's...electrical design engineering of our advanced 2D/2.5D/3D packaging solutions. You will proactively… more
- BAE Systems (Merrimack, NH)
- …to advance overall technical skills and develop R&D expertise in the forefront of Advanced Microelectronics + Be the engineering focal point for all activity ... done before challenges. FAST Labs advances science, develops technology, and delivers microelectronics products to solve the toughest challenges for our defense and… more
- Northrop Grumman (Linthicum, MD)
- …and failure analysis, the NGMC is a leader in designing, fabricating, packaging and delivering discriminating microelectronics to the military, aerospace, and ... and small - solutions living within the Northrop Grumman Microelectronics Center (NGMC). Boasting state-of-the-art design capabilities, multiple processing nodes,… more
- The Boeing Company (Huntington Beach, CA)
- …verification, packaging and test) in house. SSED has numerous microelectronics projects, funded both by internal Boeing customers and external Government Science ... accreditation is the preferred, although not required, accreditation standard. ** Lead ** Education/experience typically acquired through advanced technical… more
- Northrop Grumman (Linthicum, MD)
- …and failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... Clearance with Polygraph Preferred Qualifications forStaff Superconducting Interconnect Systems Lead : + Advanced Degrees in Electrical, Materials, Mechanical,… more
- Northrop Grumman (Annapolis Junction, MD)
- …and failure analysis, the NGMC is a leader in designing, fabricating, packaging and delivering discriminating microelectronics to the military, aerospace, and ... requirements. **Preferred Qualifications for Sr. Staff Mission Verification & Validation Lead Engineer:** + Advanced Degrees in Electrical Engineering, Computer… more
- Northrop Grumman (Linthicum, MD)
- …and failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... with Polygraph **Preferred Qualifications for Sr. Staff Digital Solutions SEIT / Lead Systems Engineer:** + Advanced Degrees in Electrical Engineering, Computer… more
- The Boeing Company (Tukwila, WA)
- …(architecture definition, circuit design, RTL, synthesis, physical layout, verification, packaging and testing). SSED owns numerous microelectronics projects, ... BR&T, Boeing's Solid State Electronics Development organization (SSED) performs microelectronics technology development for aerospace systems. SSED develops digital,… more