• Principal Engineer Packaging

    GE Vernova (Pensacola, FL)
    **Job Description Summary** As the Principal Engineer Packaging & Assembly you are responsible for the overall technical underwriting and acceptance of ... fundamental capabilities for organizational advancement. As the Principal Engineer Packaging & Assembly , your curiosity, problem-solving skills, and… more
    GE Vernova (02/02/25)
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  • Principal IC Packaging

    SpaceX (Bastrop, TX)
    Principal IC Packaging Engineer , Silicon Technology (Starlink) Bastrop, TX SpaceX was founded under the belief that a future where humanity is out exploring ... the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING ENGINEER , SILICON...hands-on and dynamic engineers with expertise in advanced semiconductor packaging assembly design, development, equipment, and testing.… more
    SpaceX (04/15/25)
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  • Principal Mechanical Engineer

    RTX Corporation (Cedar Rapids, IA)
    …for tomorrow. Are you up for the challenge? Join our mission today. ** Principal Mechanical Engineer ** **- Microelectronics Packaging (Onsite)** Looking for ... a highly motivated person to be a Mechanical Engineer within the Mission Systems (MiS) Microelectronics Packaging...Collins Aerospace Mission Systems. This position is for a Principal Mechanical Engineer involved in the design… more
    RTX Corporation (01/23/25)
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  • Senior Principal Mechanical Engineer

    BAE Systems (Cedar Rapids, IA)
    …may be available based on position level and/or job specifics. **Senior Principal Mechanical Engineer - Microelectronics Packaging (Hybrid)** **110596BR** ... Education, Experience, & Skills** + Microelectronics design and manufacturing assembly + Microelectronics packaging materials and materials properties… more
    BAE Systems (03/04/25)
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  • Principal IC Packaging Test…

    SpaceX (Bastrop, TX)
    Principal IC Packaging Test Engineer , Silicon Technology (Starlink) Bastrop, TX SpaceX was founded under the belief that a future where humanity is out ... the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING TEST ENGINEER ,...next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and… more
    SpaceX (04/15/25)
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  • Associate Principal Scientist, Composite…

    Merck (West Point, PA)
    packaging for all products. We are seeking an Associate Principal Scientist- Engineer who can bring advanced mechanical engineering science capabilities ... to our mission of delivering sustainable (biodegradable) and highly protective packaging designs for our high-value and diverse drug products, such as autoinjectors,… more
    Merck (04/02/25)
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  • Principal Engineer

    SanDisk (Milpitas, CA)
    …to keep our world moving forward. **Job Description** ESSENTIAL DUTIES AND RESPONSIBILITIES As a Packaging Engineer , you will work in the Packaging R&D group ... the modeling and simulation, design of experiment and testing across semiconductor packaging , flash memory product and host levels. + Responsible for influencing… more
    SanDisk (03/07/25)
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  • Principal Engineer - DAP Ramp Team

    Lilly (Indianapolis, IN)
    …technical support for processes, materials, systems, and equipment associated with device assembly and packaging . In addition, providing technical expertise to ... a strong safety, quality, and operationally excellent culture, the Engineer for DAP RAMP Team will be responsible for...and EU. + Analysis of operations, workflows, and device assembly and/or packaging process to provide solutions… more
    Lilly (03/04/25)
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  • Principal / Senior Principal

    Northrop Grumman (Baltimore, MD)
    …but they're also making history. Northrop Grumman Mission Systems is seeking a ** Principal /Senior Principal Electromechanical Design Engineer ** to join our ... mentoring to less experienced personnel. **This position may be filled as a Principal Electromechanical Design Engineer ** **or a Senior Principal more
    Northrop Grumman (04/10/25)
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  • Principal / Sr. Principal RF…

    Northrop Grumman (Linthicum Heights, MD)
    assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and ... analysis, and other modeling techniques ** Principal RF/Microwave Design Engineer Basic Qualifications:** +...and organic printed circuit board materials, design, fabrication, and assembly processes + Integrated Circuit packaging techniques… more
    Northrop Grumman (04/08/25)
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