• Principal HBM Package

    Micron Technology, Inc. (Richardson, TX)
    package development and further product qualifications. Segmenting and resolving chip/ package interaction issues. Micron HBM Design Technology Package ... Co-Optimization team is looking to hire an experienced semiconductor packaging Principal Engineer. Our Team's Vision is to enable predictable delivery of… more
    Micron Technology, Inc. (01/30/25)
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  • Principal Engineer - HBM SOC…

    Micron Technology, Inc. (Richardson, TX)
    …architectures to target best-in-class performance, power, cost, reliability and quality for Micron's HBM product portfolio. In HBM HIG (High Bandwidth Memory ... to craft, many innovations are needed for verification and validation of the HBM product , thereby making it uniquely exciting. **What's Encouraged Daily:** +… more
    Micron Technology, Inc. (12/09/24)
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  • Principal Engineer - HBM SOC Design…

    Micron Technology, Inc. (Richardson, TX)
    …architectures to target best-in-class performance, power, cost, reliability and quality for Micron's HBM product portfolio. In HBM HIG (High Bandwidth Memory ... to craft, many innovations are needed for verification and validation of the HBM product , thereby making it uniquely exciting. **What's Encouraged Daily:** +… more
    Micron Technology, Inc. (12/06/24)
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  • MTS / Principal Verification…

    Micron Technology, Inc. (Boise, ID)
    …analytical skills + Familiarity with DRAM operation and JEDEC specifications, preferably with HBM product family + Knowledge and experience in digital (Verilog) ... and developing modular, scalable verification solutions for the next generation HBM DRAM products spread across different customer platforms. You will be… more
    Micron Technology, Inc. (12/04/24)
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  • Principal Design Development - Technical…

    Micron Technology, Inc. (Richardson, TX)
    …driving execution across all design activities. You will be responsible for delivering HBM product DBR on schedule across internal and external foundries. You ... DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon...innovations are needed for verification and validation of the HBM product , thereby making it uniquely exciting.… more
    Micron Technology, Inc. (01/10/25)
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  • Principal Product Quality Engineer,…

    Micron Technology, Inc. (Boise, ID)
    …technical knowledge and creativity to deliver efficient and effective solutions. As a Principal Engineer in Product Quality and Reliability Assurance (PQRA) at ... qualification and quality monitoring of High Bandwidth Memory products ( HBM ), help develop product reliability methodologies, and... engineering teams + Comprehend new wafer fab and packaging technologies to identify and mitigate product more
    Micron Technology, Inc. (01/10/25)
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  • Senior | Principal , AI-optimized Platform…

    Micron Technology, Inc. (Folsom, CA)
    …drive concepts across the stack, from applications to architectures and from concept to product . This is your opportunity to make a difference in the future of ... computing! As a Senior or Principal contributor in our AI-optimized Memory Platform Architecture team, you will contribute to the definition of platform architecture… more
    Micron Technology, Inc. (01/28/25)
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  • Principal Engineer/MTS/SMTS - Signal…

    Micron Technology, Inc. (Boise, ID)
    …high speed product signaling and power designs for products like HBM , GDDR, LPDRAM, DDR5/DDR6, PCIeGen6 and sophisticated signaling development! We handle the ... engage in future performance scaling through sophisticated signaling techniques and package / channel improvement, including circuit power reduction, data encoding,… more
    Micron Technology, Inc. (01/30/25)
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