- SpaceX (Bastrop, TX)
- Principal IC Packaging Test Engineer, Silicon Technology (Starlink) Bastrop, TX Apply SpaceX was founded under the belief that a future where humanity is ... make this possible, with the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING TEST ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is… more
- SpaceX (Bastrop, TX)
- Principal IC Packaging Engineer,...reliable internet to 4M+ users worldwide. We design, build, test , and operate all parts of the system - ... the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING ENGINEER, SILICON...SMT assembly experience + OSAT (outsource semiconductor assembly and test ) experience a plus ITAR REQUIREMENTS: + To conform… more
- Broadcom (San Jose, CA)
- …and Gate All Around technology; Design experience is a plus + Working knowledge of 2.5D packaging technology and 3D stacked IC + Knowledge and use of various EDA ... and IP adaptation guidelines for the advanced semiconductor technology and advanced packaging technology + Define technology test vehicles for advanced… more
- Skyworks (Andover, MA)
- …including PVT simulations + Work with cross-functional teams from Foundry engineering, packaging , and test to realize advance prototypes. + Support development ... Sr. Principal Electrical Engineer - Analog Design Lead Apply...the needs of Connectivity products and define applicable analog test vehicles for development + Engage in all aspects… more
- Cadence Design Systems, Inc. (San Jose, CA)
- …your favorite tablet. Responsibilities: * Design and develop advanced automated design flows for 3D- IC , IC Packaging and PCB applications* Design and develop ... incorporate machine learning elements into product features* Plan, design, develop, test and maintain key software enhancements, take responsibility for quality and… more
- Qualcomm (San Diego, CA)
- …systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging , test systems, FPGA, and/or DSP systems. * ... This individual independently plans, performs the moderately-defined responsibility for the test solutions, Bring up, debug, validation and qualification of new… more
- Qualcomm (San Diego, CA)
- …with Automated Test Equipment: Advantest or Teradyne is a plus. ** Principal Duties and Responsibilities:** * Applies Hardware knowledge and experience to plan, ... systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging , test systems, FPGA, and/or DSP systems. *… more
- BAE Systems (Merrimack, NH)
- …test , production test , and qualification + Deep understanding of the full IC development process, including IC packaging approaches and wafer, die, ... partnerships and collaborate across a broad innovation ecosystem that includes DoD/ IC /OGA labs and research teams, universities, small businesses, and venture… more